| 摘要 |
PURPOSE:To provided the titled composition of low stress outstanding in crack vesistance for use in electronic and electric parts, etc., comprising an epoxy resin, novolak type phenolic resin and each specified amounts of spiroacetal ring-contg. guanamine resin and inorganic filler. CONSTITUTION:The objective composition comprising (A) an epoxy resin, (B) a novolak type phenolic resin (C) 0.1-10wt% of a spiroacetal ring-contg. guanamine resin and (D) 25-90wt% of inorganic filler (pref. silica powder or alumina). Preferably, the equivalent ratio of the epoxy group in the resin A to the phenolic OH group in he resin B fall between 0.1 and 10.
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