| 摘要 |
<p>HEAT ACTIVATABLE ADHESIVE OR SEALANT COMPOSITIONS CONTAINING ENCAPSULANTS AND PROCESS THEREFOR of the Invention A process for adhering two substrates which comprises contacting said substrates with a heat curable organic resin composition comprising (1) a member of the group consisting of (a) an ethylenically unsaturated compound, containing at least 2 carbon-to-carbon double bonds, i. e., a polyene, (b) an epoxy resin containing at least 2 < IMG > groups, and (c) a mixture of (a) and (b); (2) an encapsulated polymerization initiator for (1); and optionally (3) a thermoplastic adhesive material selected from the group consisting of polyesters, polyvinyl acetals, polyvinyl chloride, polyamides, butadiene-acrylonitrile copolymers, styrenebutadiene copolymers, styrene-isoprene copolymers, styrene-ethylene-butylene copolymers, ethylenevinyl acetate copolymers, ethylene propylene diene monomer, acrylic and methacrylic acid and their esters and mixtures thereof, and applying heat thereto by radio frequency (RF) techniques including dielectric and induction heating to form a thermoset bond. When induction heating is used, ferromagnetic and/or electrically conductive particles are usually added to the composition, either per se or in encapsulated form. The process can also be used to form sealants and coatings.</p> |
