| 摘要 |
PURPOSE:To provide the titled composition of low stress outstanding in moisture resistance and hot-cold cycle characteristics, for use in electronic and electric parts, etc., comprising a specific bifunctional epoxy resin, novolak type epoxy resin and specified amount of inorganic filler. CONSTITUTION:The objective composition comprising (A) a bifunctional epoxy resin of formal I (R is of formula II, III, IV or V), (B) a novolak type phenolic resin (e.g., a product made by reaction between phenol, etc. and formaldehyde etc.) and (C) 40-85wt% of inorganic filler (pref., silica powder or alumina). The amount of the resin B to be incorporated is pref. such that the equivalent ratio of the epoxy group in the resin A to the phenolic OH group in the resin B fall between 0.1 and 10.
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