| 摘要 |
PURPOSE:To package memory elements with the many numbers of bonding pads by connecting a bonding pad arranged for respective blocks on a magnetic memory element with a bonding pad on a wiring substrate. CONSTITUTION:A bonding pad 5 is placed for respective blocks of a magnetic memory element 1, a bonding pad on a wiring substrate overlapped on the magnetic memory element is connected by a bump formed on the magnetic memory element or the wiring substrate. At the lower surface of the wiring substrate (thickness 0.2-0.5mm), the above-mentioned connection with the magnetic memory element is connected, a through hole connected from the bottom to the top of a substrate 2 is formed, and the connection is executed with a diode for connecting a matrix arranged on the upper surface. The output of a matrix circuit is drawn out from a memory element, a rotation magnetic field coil wound at the circumference of the wiring substrate and a bias magnetic circuit place at the upper and lower parts of the rotary magnetic field coil to the external part. By a matrix diode 4 provided on the wiring substrate 2, the number of drawing wirings can be minimized.
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