| 摘要 |
PURPOSE:To make it possible to change the degree of thermal coupling of a heating resistor to a thermistor, by a method wherein the condition of thermal coupling between the thermistor and the heating resistor is changed by performing a trimming for a conductor connected to the heating resistor and/or a resistor. CONSTITUTION:Through holes 15 are formed in a region containing holes 11 on the front and the rear surfaces of an insulating substrate 12, and conductors 16 which are connected to the through holes 15 in a body and to both ends of a resistor 13 and heating resistors 141-143. A chip thermistor 17 is mounted via solder between the conductors 16, 16 on the opposite side of the substrate 12 to the heating resistors 141-143. A semiconductor element, for example a power transistor 18, is mounted via solder between the conductors 16, 16 on the front surface of the substrate 12. The heating resistors 141-143 are subjected to trimming, for example by laser, and a nick 19 is formed in the heating resistors 142 and 143, which are separated. An integrated circuit is manufactured by forming the nick 19 in a part of the heating resistor 141 situated just under the chip thermistor 17.
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