| 摘要 |
PURPOSE:To make it possible to form thinly a liquid state cladding resin film with simple means, by providing the bottom of a plastic case with a hole part' and sealing it tightly with thermosetting solid resin. CONSTITUTION:A hybrid integrated circuit element composed of a thick film substrate 2, electronic parts 3 and a terminal 4 ids coated with a liquid state cladding resin film 5 such as silicone resin, epoxy resin and urethane resin, and accommodated in a plastic case 1. In the bottom of the case 1, a penetrating hole (a) is formed. The resin film 5 stays at the bottom of the case 1 by the effect of the weight of a liquid state resin before it is hardened by heating, but it flows out from the case 1 because the bottom of the case 1 is provided with a hole (a) After the liquid state cladding resin unnecessary for coating of electronic parts almost flows out, the resin film 5 which attaches to the electronic parts and remains is hardened by heating and seals the hole 5 tightly. The lower part of the resin film 5 is fixed to the bottom of the case so as to extend toward the periphery, and reinforces the electronic parts.
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