| 摘要 |
PURPOSE:To obtain a thermosetting resin composition excellent in heat resistance and curability and suitable for solventless varnishes, laminating materials and molding materials, by using an N-substituted unsaturated imide compound and a pyridazine (derivative) as essential components. CONSTITUTION:A thermosetting resin composition prepared by using pyridazine or its derivative and an N-substituted unsaturated imide compound of the formula (wherein Y is H or CH3 and Z is an m-valent organic group), e.g., N- phenylmaleimide or N,N'-ethylenedimaleimide, as essential components. Although a resin system based on an N-substituted maleimide compound which is an addition type and produces no volatile by-product when cured (molded) has heretofore been used in order to impart heat resistance to class C solventless varnishes, laminating materials or the like, there is a difficult in simultaneously realizing rapid curability and heat resistance. The thermosetting resin composition of this invention excels in both of heat resistance and curability and is suited for, especially, solventless varnishes, laminating materials and molding materials.
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