| 摘要 |
PURPOSE:To obtain a lead material for electronic parts excellent in repeated bendability and migration resistance, by specifying a composition consisting of Ni, Si, Sn, Zn, Mg, Cr, Ti, Zr, and Cu. CONSTITUTION:The lead material for electronic parts excellent in repeated bendability and migration resistance has a composition consisting of, by weight, 1.0-3.5% Ni, 0.2-0.9% Si, 2.0-4.5% Sn, 1.0-5.0% Zn, 0.02-1.0%, Mn, further 0.0005-0.02% of one of more among Mg, Cr, Ti, and Zr, and the balance essentially Cu. Further, this lead material has superior spring characteristic, heat resistance, thermal peeling resistance of plated tin and solder, stress corrosion cracking resistance, hot workability, and the like.
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