| 摘要 |
PURPOSE:To obtain an oxygen-free copper-base dilute alloy having low-temp. softening characteristic, by incorporating specific amounts of Nb, independently or in combination with Ti, Zr, etc., and also by specifying inevitable-impurity content. CONSTITUTION:The oxygen-free copper-base dilute alloy with low-temp. softening characteristic has a composition which contains, by weight, 0.001-0.05% Nb or Nb and at least one kind among Ti, Zr, Hf, V, Ta, Fe, B, Ca, Mg, and misch metal and in which the total content of inevitable impurities such as O2, etc., is regulated to <=0.005%. By using this alloy, a copper foil for flexible printed circuit board capable of softening at a temp. of the curing temp. of resin or below can be obtained.
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