| 摘要 |
PURPOSE:To bond a wire positively, and to improve the reliability of a connecting section by forming filling sections in an air gap section and a clearance section at a position held by an island and a tie bar. CONSTITUTION:A plurality of leads 23 disposed at predetermined air gaps 24 from an island 22 while prescribed clearances 25 are held mutually in the island 22, on which a semiconductor element is loaded, and in the periphery of the island and tie bars 23-2 mutually connecting the leads 23 are provided. Filling members 27 consisting of a resin are shaped in the air gaps 24 and the clearances 25 positioned inside the tie bars 23-2. Accordingly, the deformation of the internal end sections of the leads is prevented, wires can be bonded positively while the deformation of the whole lead frame 21 and sections in the vicinity of pinholes is obviated, and the semiconductor element is easily positioned accurately to a mold for resin seal, thus allowing the improvement of operating efficiency and precise resin seal. |
