| 摘要 |
PURPOSE:To eliminate a shift in alignment position and to obtain a superior optical fiber solder connection structure which has small output loss by fusing a solder chip which is so arranged on a head as to surround three sides of an optical fiber by a heating means from above. CONSTITUTION:The semiconductor chip 10 which is so arranged on the header as to surround the three sides of the optical fiber 2 including the upper and lower sides is prepared and fused by the heating means from above as to the optical fiber solder connection structure where the optical fiber 2 aligned with a semiconductor laser light emission part 4 is fixed on the header 1. The semiconductor chip 10 above the optical fiber 2 is heated and fused to flow down by its own weight, the quantity of movement for pressing down the optical fiber 2 is reducible, so the optical fiber 2 is easy to return to the initial position of alignment with the semiconductor laser 4 at the time of the fusing of solder and the position shift is eliminated, so that the output loss of the semiconductor laser 4 is reduced.
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