| 摘要 |
PURPOSE:To make performance of an OSL wafer uniform and to obviate the need of bevelling it again, by bevelling the top and rear faces of a semiconductor substrate wafer serving as the starting wafer of the OSL wafer, to provide the bevels having largely different widths between the top and rear faces. CONSTITUTION:A semiconductor substrate wafer 10 serving as the starting wafer of an OSL wafer (one side lapped wafer) 10 is provided with bevels 11 and 12 having largely different widths between the top and rear faces, so that the top and rear faces of the substrate can be distinguished easily from each other by the difference in width. Accordingly, substrates can be arranged properly with the top or rear faces faced properly for performing a diffusion process. Further, the substrate can be one side lapped properly on the right face and, hence, performance of the OSL wafer can be uniformized. Further, since the bevel 11 or 12 is left on the one side lapped face still after the OSL treatment, there is no need of bevelling again for performing a polishing treatment or the like.
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