| 摘要 |
PURPOSE:To easily incorporate a piezoelectric thin film to an adjacent integrated circuit without damaging the piezoelectric thin film by protecting the piezoelectric thin film by a 2nd dielectric film and connecting it to the metallic film wire through a connection hole formed to a part of the dielectric film. CONSTITUTION:A 1st dielectric film 4 is formed on a protective film 3 with the protection film 3 so as to form an air gap layer whose part has openings 5a, 5b. A 1st electrode 6, the piezoelectric thin film 7, a 2nd electrode 8 and the 2nd dielectric film 9 are formed on the dielectric film 4 sequentially. The protection film 3 on the metallic wire pattern 2 is etched at two positions to form a connection hole 12 and a metal such as Al, Au/Ti or the like is formed to form the metallic film wire 13 by etching. Thus, the thin film 7 is incorporated easily to the adjacent integrated circuit without giving damage to the thin film 7.
|
