| 摘要 |
PURPOSE:To enable alignment of a printed wiring board and an exposure mask before photocuring a photosolder-resist layer by forming an image capable of confirming the position of the exposure mask with vision by irradiating light on a layer composed of a high polymer for the alignment. CONSTITUTION:A liquid photosolder-resist material (a) is applied on the substrate (c) of the printed wiring board followed by applying a solution (b) of the high polymer which has transparency for an active ray and contains a dye capable of effecting photolysis at a specific wavelength range on the obtd. substrate. The obtd. substrate irradiate the light (e) through the exposure mask (f), thereby effecting the photolysis of the dye and the alignment exposure, and the active light (g) is irradiated to the photosolder-resist (a) to effect the photocuring exposure. And, the photosolder-resist material (a) is developed, followed by removing the cured part of the photosolder-resist material. The high polymer coating (b) irradiates the light having the specific wavelength range in the amount necessary for effecting the photolysis of the dye, thereby confirming the position of the exposure mask with vision by referring to the discoloring and the undiscoloring parts of the dye, respectively. |
