发明名称 SPUTTERING APPARATUS
摘要 A sputtering apparatus for coating by the use of a target cathode within a vacuum chamber an article to be treated which is held on an article holding means within the vacuum chamber. The target cathode is of a tubular skeleton structure and is disposed so as to surround the article holding means.
申请公布号 DE3278427(D1) 申请公布日期 1988.06.09
申请号 DE19823278427 申请日期 1982.08.25
申请人 MITSUBISHI KINZOKU KABUSHIKI KAISHA 发明人 ITABA, TAKESHI;NISHIYAMA AKIO;KIKUCHI, NORIBUMI;SHINGYOJI, TAKAYUKI;OHSAWA, YUZO
分类号 C23C14/42;C23C14/34;H01J37/34;(IPC1-7):C23C14/34 主分类号 C23C14/42
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