| 摘要 |
PURPOSE:To prevent a short circuit due to the contact of a wire by a method wherein a semiconductor element is loaded in a vessel, the wire is bonded, one part of the bonding wire is covered with an insulating film and the semiconductor element is sealed by the vessel with a beam outlet or inlet window. CONSTITUTION:A light-emitting diode 2 is loaded to a stem 1, a wire is bonded and the central section of the bonding wire 3 is covered with an insulating film 6, and the diode 2 is sealed with a cap 4 using a ball lens 5 as a beam outlet window. A resin such as a thermo-setting silicone resin is employed as the insulating film 6, and applied at the central section of the wire 3 in thickness of approximately 5-20mum after the wire is bonded. Accordingly, since the wire 3 is covered with the insulating film 6, the wire 3 is not brought into contact directly with the internal surface of the cap 4, thus preventing a short circuit due to the contact of the wire, then improving reliability. |
