| 摘要 |
PURPOSE:To facilitate handling when scraps are recovered and to simplify an assembling process, by using a Cu material for a layer, which is bonded to the surface of Ag provided at lead-attaching position facing two side surfaces of a package and the like. CONSTITUTION:An Fe-alloy based substrate comprises Ni-Fe alloy and Ni-Co-Fe alloy. At least one line of a Cu layer is deposited on a stripe patterned clad plate in the longitudinal direction on at least one main surface of the substrate. Blanking is performed in the clad layer in a shape having required dimensions. Thus a lead frame material is formed. A ceramic package is separately formed. A metallized surface comprising W, Mo and the like is formed at an outer-lead attaching position of said package beforehand. Ag is printed and formed in a required pattern on the metallized surface by plating or paste application. The Cu layer of the blanked lead frame material is closely contacted with the surface of the Ag. With the close contact being kept with a jig, the frame is heated. Thus the lead frame can be assembled in a unitary body.
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