| 摘要 |
PURPOSE:To obtain the titled composition, containing a polyfunctional epoxy compound and metal salt monomer or polymer of a specific structure and useful for semiconductor devices having a possibility of the operation with high reliability even when allowed to stand under high temperature and humidity condition for a long period. CONSTITUTION:A composition obtained by, e.g. kneading (A) a polyfunctional epoxy compound with (B) a metal salt monomer and/or polymer expressed by formula I (X is various substitution products; Mx is metal) and/or formula II while heating, etc. Furthermore, bisphenol A diglycidyl ether, etc., are preferably used as the component (A) and calcium acrylate, etc., are preferably used as the component (B).
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