| 摘要 |
PURPOSE:To obtain a circuit board, in which the bonding errors of inner leads can be repaired with the bonding of outer leads, by providing inner leads for bonding said inner leads, and providing outer lead bonding pads, which are conducted to the inner leads. CONSTITUTION:Inner leads 1 for bonding other inner leads are provided along the periphery of a hole in a circuit board B. Outer-lead bonding pads 2, which are conducted to the leads 1, are provided at the outside of the leads 1. Peripheral circuits are provided on the board B. When bonding errors occur in the inner leads 1 at the time of automatic bonding, the leads are removed, and outer leads are bonded to the pads 2, which lead to the leads 1. Thus, the peripheral circuits, which becomes unusable in a conventional device, can be effectively utilized.
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