发明名称 CAPILLARY AND ITS MANUFACTURE AND THERAL SOUNDWAVE BONDER
摘要 <p>A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.</p>
申请公布号 JPS63137445(A) 申请公布日期 1988.06.09
申请号 JP19870290448 申请日期 1987.11.17
申请人 AIR PROD AND CHEM INC 发明人 ROBAATO BAATEIN;MAIKERU BII MIRAA;BUURU EMU MUUN;ROBAATO SHII POSUTO
分类号 H01L21/607;B23K20/00;C23C16/01;C23C16/32;H01L21/60 主分类号 H01L21/607
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