发明名称 |
CAPILLARY AND ITS MANUFACTURE AND THERAL SOUNDWAVE BONDER |
摘要 |
<p>A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.</p> |
申请公布号 |
JPS63137445(A) |
申请公布日期 |
1988.06.09 |
申请号 |
JP19870290448 |
申请日期 |
1987.11.17 |
申请人 |
AIR PROD AND CHEM INC |
发明人 |
ROBAATO BAATEIN;MAIKERU BII MIRAA;BUURU EMU MUUN;ROBAATO SHII POSUTO |
分类号 |
H01L21/607;B23K20/00;C23C16/01;C23C16/32;H01L21/60 |
主分类号 |
H01L21/607 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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