| 摘要 |
PURPOSE:To obtain the best soldering for various circuit boards which are fed, by inputting an input of solder heating, an input of a jet feeding machine, and jet width and an input of a substrate carrying machine, to a controller, and controlling automatically a solder temperature, a jet quantity and its speed, and a carrying speed. CONSTITUTION:In a device for executing jet soldering to a circuit board 26 which is carried in continuously, an electric input of a heater 13 for bringing a solder liquid 12 to a temperature rise, an input of a DC motor 18 of a pump 17 for determining a jet quantity, an input of a pulse motor 22 for determining the jet width (d), and an input of a DC motor 25 for carrying the board 26 are inputted to a controller. The controller controls automatically a detected temperature of the solder liquid 12, a jet quantity in a nozzle jet port 15 and a jet speed, and a carrying speed of the board 26 by a carrying mechanism 24, and always executes optimum soldering to various circuit boards 26 which are fed. In this regard, a jet difference in the longitudinal direction in the jet port 15 is brought to a width adjustment by a pressure gauge 23. |
