| 摘要 |
PURPOSE:To obtain the titled composition, containing a polyamic acid having a specific structure, capable of providing relief images having high heat resistance in a state of residual photosensitive groups even after heat treatment without requiring thermal decomposition of the photosensitive groups and useful as protective films of semiconductors, etc. CONSTITUTION:A composition obtained by blending a polyamic acid having repeating units expressed by the formula (R1 and R2 are aromatic cyclic group; R3 and R4 are aromatic cyclic group or aliphatic group; n is 1 or 2) and a photosensitizer or photopolymerization initiator if necessary added. The above- mentioned polyamic acid is preferably obtained by, e.g. dissolving a diamine in a polar solvent such as dimethylformamide, etc., then adding an acid anhydride, stirring the resultant reaction mixture, etc. |
