| 摘要 |
PURPOSE:To facilitate layout work, by arranging a plurality of connecting bumps along the periphery and the inner lines of an LSI chip, arranging the bumps in a zigzag pattern at a part, and providing short-circuit preventing bumps at arbitrary positions beneath input/output terminals so that one end of each terminal is fixed to an insulating film and the other end is fixed to the connecting bump. CONSTITUTION:A plurality of connecting bumps 2 are arranged in a grid pattern along the cross lines at the inner central part of an LSI chip 1 so that input/output terminals 4, which are connected to the bumps 2, are not overlapped. At a part, where the terminals 4 can be exteneded along the central cross lines, the bumps are arranged in a zigzag pattern between the periphery of the chip and the central part. Thus the number of the bumps is increased. Meanwhile a chip containing part 8 is formed in an insulating film 7 by blanking. The input/output terminals 4, wiring patterns 5 and test electrodes 6 are provided as specified. The bump 2 and the terminal 4 undergo position alignment so as to face one to one, and they are connected. Short- circuits preventing bumps 3 are provided on the surface of the chip at the lower side of the terminals 4. Thus the direct contact between the terminals 4 and the surface is prevented. In this way, the IC chip having many terminals is completed.
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