发明名称 Device for making contact with connections
摘要 <p>Electrical components having parallelepiped housings (5, 6, 7) are inserted into depressions (2, 3, 4) in a carrier board (1). In order to connect the components to a flexible conductor foil without soldering, a flexible conductor foil (11), which exhibits the conductor tracks (12, 13), is placed in an aligned manner on the surface (8) of the carrier board (1) and is pressed against the said surface (8) such that the conductor tracks (12, 13) make contact with the connections (9, 10) of the components. <IMAGE></p>
申请公布号 DE3641353(A1) 申请公布日期 1988.06.09
申请号 DE19863641353 申请日期 1986.12.03
申请人 SCHOELLER & CO ELEKTROTECHNISCHE FABRIK GMBH & CO 发明人 BURGETH,HEINZ;HORMES,WINFRIED;TESSENDORF,GUENTER,DIPL.-ING.
分类号 H05K1/18;H05K3/30;H05K3/32;(IPC1-7):H05K3/32 主分类号 H05K1/18
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