| 摘要 |
An IC module having a circuit board with obverse and reverse sides on which IC chips are mounted. This IC module is provided with at least one pair of IC chips having inverted operating circuit patterns and mounted back-to-back on the obverse and reverse sides of the circuit board at desired positions such that the inverted operating circuit pattern of one chip coincides with that of the other as seen through the circuit board, at least one printed circuit board pattern corresponding to one of the operating circuit patterns and formed on one of the obverse or reverse sides of the circuit board and used in common for the pairs of IC chips, wire-bonding pads formed around the peripheries of each of the pair of IC chips to connect the circuit board pattern to the terminals of the pair of IC chips, at least one board through hole for connecting the wire-bonding pads on one side of the circuit board to the other, and a pair of selecting signal lines provided for the pair of IC chips. Further, it is possible to form independent or separated circuit board patterns which are for different objects on both the obverse and reverse sides of the circuit board, respectively, and use them in common for both sides thereof. |
