| 摘要 |
PURPOSE:To effectively form a fine pattern with good controllability by modifying with etching resistance an exposed layer to be modified, removing the layer to be modified except a modified layer and a protecting film, and etching a layer to be etched with the modified layer as a mask to form a pattern. CONSTITUTION:The boundary A of a layer 2 to be modified made of exposed epoxy resin is coated with an epoxy resin hardener in contact therewith, to be modified for hardening part of the resin, thereby forming a modified layer 4. This layer 4 is scarcely dissolved in an organic solvent, and has an etching resistance against an RIE. The resin is modified (hardened) in contact with the hardener. A protecting film 3 on the layer 2 limits the exposed part of the layer 2 to prevent the excess modification from above. The layer 4 formed in this manner becomes an etching mask in case of forming a wiring pattern. Accordingly, since the lateral thickness l of the modified layer is represented as the fine wire pattern width, it is important to control the thickness l of the modified layer. Thus, a pattern can be effectively formed with good controllability even as the fine pattern of 0.5mum wide or less.
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