| 摘要 |
PURPOSE:To manufacture a lead frame for an IC having high adhesion with low melting point glass by forming the oxide film of an Fe-Ni alloy consisting of Fe3O4, Fe2O3 and NiO onto the surface of an Fe-Ni alloy blank in a section not coated with an Al layer at a specific volume ratio. CONSTITUTION:It is preferable that Al to be coated is cold-rolled so as to acquire the degree of working of 20% or more in order to obtain the sufficient adhesion of a blank substrate 18 and an Al layer 12. The blank substrate 18 is punched and machined to the pattern of a desired lead frame. A plurality of heat treatment is executed to the lead frame 11 punched to the pattern, and the oxide film of an Fe-Ni alloy is formed onto the surface of an Fe-Ni alloy blank in the lead frame 11. The oxide is shaped so as to keep the relationship of the volume of Fe3O4>the volume of Fe2O3>the volume of NiO at a volumetric ratio.
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