| 摘要 |
<p>PURPOSE:To prevent the deformation of leads, and to obviate the frequent occurrence of the defective soldering of bridges, plugs, etc., by constituting a semiconductor device of a plurality of the leads protruded at regular pitches from a resin body section and a support section being integrally extended by the same material as the resin body section, supporting outer leads and thus imparting rigidity. CONSTITUTION:A semiconductor device consists of a resin body section 1, in which a semiconductor chip is sealed, outer leads 2..., which are projected and formed from the resin body section 1, connected electrically to said semiconductor chip, reflow-soldered to a circuit substrate and made of an alloy such as a copper alloy, and a support section 3 supporting these outer leads 2..., The copper alloy, which has small rigidity but has large thermal conductivity and cost of which is reduced, can be used in place of a conventional iron (Fe)- nickel (Ni) alloy as the material of the outer leads 2.... Since the projecting pieces 3a... of the support section 3 function as dams, there is a merit that the defective soldering of bridges, plugs, etc., is reduced. Accordingly, the quantity of solder need not be controlled precisely, thus extending a working range.</p> |
