| 摘要 |
PURPOSE:To conduct uniform exhaustion of a wafer during wafer processing and to prevent a foreign matter from adhering to the wafer during the processing by exhausting a wafer processing unit through an exhaust in the side of the unit on conducting the exhaust, and providing an exhaust gas recovering mechanism which can regulate its exhaust port amount at that time. CONSTITUTION:A wafer 1 is attracted by a spin chuck 2 to be held, and processed while being rotated in a direction 9. In this case, gas is exhausted by an exhaust recovery fan 5 in which blades 4 rotating in a direction 10 are attached from the side exhaust port 3 of a wafer processing unit, and further exhausted to a main exhaust port 6. At this time, the exhaust amount is regulated by controlling the rotating speed of the fan 5. Thus, the processing wafer can be uniformly exhausted to prevent a foreign material from adhering to the wafer. |
