| 摘要 |
PURPOSE:To make it possible to realize high speed continuous molding by a method wherein a new plate-shaped middle force is installed between a top and a bottom forces at the stage that thermoplastic resin filled in the middle force cures to some extent so as to perform the operation for removing resin molded item from the plate-shaped middle force, into which resin has been poured, is done in parallel to the operation for pouring resin in the new middle force. CONSTITUTION:A semiconductor lead frame 36 is pinched between an upper and a lower product plates 30 and 31. In addition, a runner plate 34 is laminated beneath the lower product plate 31 so as to form a plate-shaped middle force 3. The thermoplastic resin, which is poured out to the force, is filled through gates 35 into the cavities of the product plates 30 and 31 and cools down and cures. At the stage that the resin cures to some extent, the top force 1 and the bottom force 2 are parted from each other in order to remove the middle force 3 from and to install a middle force, the cavities of which are empty, to the forces 1 and 2. The removed middle force 3 is demolded at a separate workshop and prepared for next use. Accordingly, the curing time of item can be shortened to a far greater extent. Since the middle force is made to be detachable from the top and the bottom forces, one cycle of molding process can be shortened to a far greater extent, resulting in allowing to realize a high speed molding operation.
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