发明名称 Plating current automatic compensating apparatus
摘要 An apparatus in which plating currents of a plurality of successive plating cells are normally automatically controlled in accordance with line speed to maintain uniform plating thickness, and in which the number of energized plating cells is increased or decreased in accordance with line speed to maintain plating current density within a predetermined range, includes tracking or timing facilities for progressively changing plating currents of plating cells in correspondence with movement of the strip being plated through the cells after the number of energized cells has been increased or decreased so as to reduce plating thickness variation on the portion of the strip within the plating cells at the time of the change in the number of energized cells.
申请公布号 US4749460(A) 申请公布日期 1988.06.07
申请号 US19870004564 申请日期 1987.01.20
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA;NIPPON STEEL CORPORATION 发明人 KOMOTO, HARUO;HAMADA, SHIGEHARU;SHIINOKI, YASUO;NAGANO, KATSUMI;SATO, MICHIO;GOSHI, HIROO
分类号 C25D21/12;G05D5/02;(IPC1-7):C25D17/00 主分类号 C25D21/12
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