| 摘要 |
PURPOSE:To efficiently apply electroplating to a material to be plated by approaching a reciprocating insoluble metal to a soluble anode to form a plating layer, and then approaching the metal to the material to be plated to dissolve the plating layer. CONSTITUTION:The soluble anode 3 easy to exchange is fixed in an insulated electroplating bath 2, a strip 1 is passed in the direction as shown by the arrow through conductor rolls 4 and 4 as the cathodes, and a plating soln. is countercurrently supplied from a nozzle 5 and discharged from an from an overflow port 6. In the electroplating device of such a structure, the endless insoluble electrodes 8 reciprocated by rolls 9 are provided respectively between the soluble anode 3 and the strip 1. Furthermore, the insoluble electrode 8 is negatively charged against the soluble anode 3 and positively charged against the strip 1 by a DC power source 10 and a variable resistance. As a result, the insoluble electrode is approached to the soluble electrode 3 to form a plating layer and then approached to the strip 1 to dissolve the plating layer, and the strip 1 is electroplated.
|
