| 摘要 |
<p>A multilayer printed circuit board comprises: part terminal insertion holes and part terminal insertion lands formed at intersecting points between a first plurality of main reference grid lines extending in one direction and a second plurality of main reference grid lines extending in the other direction perpendicular to the one direction; at least two signal layers, one of the signal layers being constituted by first signal lines disposed on a plurality of ones of first subsidiary grid lines drawn parallelly with the first main reference grid lines on positions obtained by equidistantly dividing each gap between adjacent ones of the first main reference grid lines into n portions, the other one of the signal layers being constituted by second signal lines disposed on a plurality of ones of second subsidiary grid lines drawn parallelly with the second main reference grid lines on positions obtained by equidistantly dividing each gap between adjacent ones of the second main reference grid lines into n portions; and via holes formed on diagonal lines of the first and second main grid reference lines at positions displaced from intersecting points between the first and second signal lines to be close to intersecting points between the first and second main grid reference lines, each of the via holes having a diameter smaller than that of each of the part terminal insertion holes and the part terminal insertion land, the via holes being exclusively used for connecting the first and second signal lines, a plurality of ones of the via holes being formed in each of regions encircled by the first and second main grid reference lines.</p> |
