| 摘要 |
PURPOSE:To provide fine-grained copper films causing no cracking to through holes, etc., by chemical plating by adding a carboxylic acid other than formic acid to a chemical copper plating soln. contg. formaldehyde. CONSTITUTION:A proper amt. of a carboxylic acid other than formic acid, e.g., acetic acid is added to a chemical copper plating soln. contg. formaldehyde as an essential component. A fine-grained copper film having satisfactory physical properties is obtd. by chemical plating with the resulting plating soln. When the plating soln. is used to plate the through holes in a printed circuit board, a high density printed circuit board having a high degree of integration can be obtd. |
