Method of connecting a semiconductor device to a wiring board

摘要

Method of connecting a semiconductor device to a wiring board in which electrical connection of metal bumps of a semiconductor device and wiring pattern of a wiring board is accomplished by pressure application between the bumps and wiring pattern, and mechanical fixing of the semiconductor device on the wiring board is accomplished by stiffened resin by use of which resin, the semiconductor device is fixed to the wiring board. By such separation of electrical connection and mechanical fixing, reliability of both function may be improved.