| 摘要 |
PURPOSE:To cut a wire easily even if its diameter is large by a method wherein the wire is pressed against a semiconductor component by a tool and bent at a joint of the tool and then cut. CONSTITUTION:After a wire 4 is bonded to the 2nd bonding point Lp, the wire 4 is clamped by a wire clamper 20. A titubation lever 41 is rotated by a wire bending cam 40 counterclockwise for a certain angle with a fulcrum shaft 43 as a center and rotates the wire clamper 20 clockwise with a pin 23 as a center (double-dot chain line). A wire cut lever 25 is rotated by a wire cut cam 24 counterclockwise with a fulcrum shaft 26 as a center. The 2nd wire cut lever 29 is rotated clockwise with a fulcrum shaft 31 as a center and the wire clamper 20 leaves a tool 11 while holding the wire 4 and the wire 4 is cut at the bonding part. |
