| 摘要 |
PURPOSE:To permit formation of a heat insulating groove layer having high adhesiveness to an aluminum substrate by adhering grooves of a UV curing type resin onto the Al alloy substrate by using a non-solvent type adhesive agent. CONSTITUTION:The non-solvent type adhesive agent 2 such as hot melt is uniformly coated on the surface of the Al alloy substrate 1. The UV curing type resin is coated on the surface of a stamper 3 for grooving and is cured. The substrate 1 and the stamper 3 are so stuck to each other that the adhesive agent 2 and the resin surface confront each other. The stamper 3 is stripped after the adhesive agent 2 is cured. As a result, the heat insulating groove layer having the high adhesiveness to the Al alloy is formed on the substrate 1. Since the release property of the stamper is excellent, the uniform groove layer having a good transfer property is formable.
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