| 摘要 |
PURPOSE:To bond-fix and remove IC chips or condenser chips easily at low temperature and within a short time by means of using tetraglycylglyamine represented by specific structural formulas and conductive bonding agent containing conductive powder. CONSTITUTION:Tetraglycylglyamine represented by structural formulas and conductive bonding agent containing conductive powder are applicable to the title semiconductor element. In said formulas, R represents dialiphatic group, diaromatic group and dialicyclic group. IC chips are condenser chips can be easily bonded to one another at low temperature and within a short time using said bonding agent. The bonded chips are provided with bonding strength resistant to wire bonding process at 200 deg.C. In order to replace any defective chips, they can removed easily at the temperature of around 250 deg.C. |
