发明名称 MOLD APPARATUS FOR RESIN MOLDING
摘要 PURPOSE:To increase the number of moldings to be molded at the same time and to attempt to improve productivity and to reduce the cost of the molding, by providing first and second molds on both sides of a hot runner manifold mechanism, supplying a molten resin into the first and the second molds to mold moldings and separating the moldings at the gate. CONSTITUTION:When a molten resin is injected from a nozzle 27 while a mold is being locked, the resin is supplied into cavities A and B of a first and second molds 1 and 2 through a hot runner manifold mechanisms. The resin in a resin path 33 is kept in a molten state by heating by means of a heater. A movable die plate 8 is moved in the direction of an arrow mark 13. When a core mold 16 is separated from a cavity mold 1a in a specified distance, the cavity mold 1a is also pulled by a connecting plate 16 in the direction of an arrow mark 14. When a cavity mold 2a of the second mold 2 is thereby separated from a core mold 2b by a specified distance, an extrusion mechanism 20 is moved by means of a rod 25 in the direction of an arrow mark 24, and a ring 11 molded in the mold 2 is pulled out from the core mold 2b. At the same time, the movable die plate 8 is stopped. An extrusion mechanism 19 is thereafter moved in the direction of an arrow mark 23, and the ring 11 molded in the mold 1 is pulled out from the core mold 1b.
申请公布号 JPS63132019(A) 申请公布日期 1988.06.04
申请号 JP19860279021 申请日期 1986.11.21
申请人 TOSHIBA CORP 发明人 HOSONO YUKIHITO;GOTO YOSHIYASU
分类号 B29C45/26;B29C45/32;B29C45/73 主分类号 B29C45/26
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