发明名称 SEALING RESIN COMPOSITION
摘要 PURPOSE:To obtain the titled composition useful as electronic and electric parts, etc., having low stress, excellent water-vapor resistance and warm-cold cycling properties free from occurrence of cracks, containing an epoxy resin, a novolak phenolic resin, a specific amount of polysulfide rubber and a specific amount of an inorganic filler. CONSTITUTION:The aimed composition containing (A) an epoxy resin, (B) a novolak type phenolic resin (e.g. obtained by reacting phenol, etc., with formaldehyde, etc.), (C) 0.1-10wt% polysulfide rubber (e.g. obtained by condensing an alkyl dichloride containing chlorines at both the ends with an alkali polysulfide) and (D) 25-90wt% inorganic filler (preferably silica powder or alumina). The equivalent ratio of the epoxy group alpha of the resin A and the phenolic OH group beta of the resin B of (alpha/beta) is preferably 0.1-10.
申请公布号 JPS63132930(A) 申请公布日期 1988.06.04
申请号 JP19860277859 申请日期 1986.11.22
申请人 TOSHIBA CHEM CORP 发明人 ONO TAKESHI;SAWAI KAZUHIRO
分类号 H01L23/29;C08G59/00;C08G59/18;C08G59/62;C08L63/00;H01L23/31 主分类号 H01L23/29
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