发明名称 WAFER CONVEYING DEVICE
摘要 <p>PURPOSE:To convey stably wafers and to upgrade the treatment efficiency thereof by a method wherein the wafers are placed on trays to be conveyed and treated. CONSTITUTION:Laminated wafers W at the time before they are treated are fed out one sheet by one sheet by a wafer feeding-out unit 1. The wafers W are placed on trays one sheet by one sheet by a wafer transfer unit 2 and the wafers W are treated by etching along with the trays in a vacuum treating chamber via a load chamber by a conveying unit 3. The wafers W treated by etching are conveyed to an unloading chamber by a conveying unit 4 are the wafers are separated from the trays by a wafer separating unit 5. The empty trays are returned into the wafer transfer unit 2, stand-by for the following untreated wafers are the treatment finished wafers are housed in a wafer housing unit 6. In such a way, if the wafers are placed on the trays and conveyed, the wafers not only can be stably conveyed but also the wafers are placed on the trays at the time of etching treatment in the vacuum treating chamber. As a result, the treatment efficiency is upgraded.</p>
申请公布号 JPS63132443(A) 申请公布日期 1988.06.04
申请号 JP19860279416 申请日期 1986.11.22
申请人 TOKUDA SEISAKUSHO LTD;TOSHIBA CORP 发明人 NAGOSHI TADANOBU;ROKUSHA TERUMI;MURAKAMI YUICHI
分类号 H01L21/302;B65G49/07;B65H5/00;H01L21/3065;H01L21/677;H01L21/68 主分类号 H01L21/302
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