| 摘要 |
<p>PURPOSE:To increase the strength against bending stress and prevent the breakage of a semiconductor chip, by applying a resin-coated metal substrate and the like having a large strength against bending stress, to a dam substrate constituting a thin multilayer substrate stacked on the main body of a substrate. CONSTITUTION:On the main body 1 of a substrate constituted of glass epoxy resin, BT resin, etc., a semiconductor chip 3 is mounted and fixed with an adhesive agent 4. An external electrode 6 formed on the rear of the main body 1 and surface leads 7 connected by a wiring in the substrate are connected to the surface electrode of the chip 3 with fine metal wires 9. A dam substrate 2 is constituted of a material having large strength against bending stress, such as a resin-coated metal substrate, a metal substrate and a ceramic substrate, and reinforces the substrate 1.</p> |
