发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To etch to a desired position with good controllability by retaining a first buried film selectively only on a region having a wide groove width to easily flatten the surface with good distribution. CONSTITUTION:The film thickness of a first insulator 3 is formed substantially equally to a groove depth, the insulator 3 is retained selectively only on an element separating region having a wide groove width. Thus, when a second insulating film 5 is deposited, the element separating region having the wide groove width and the film 5 on the element forming region are substantially equal in height. When fluid substance 6 and the film 6 are etched under the conditions of the same etching speed, the etching area of the film 5 is abruptly reduced. Accordingly, the optical intensity of the specific wavelength is abruptly varied. Thus, the end point of etching can be easily detected to be etched uniformly with good control.
申请公布号 JPS63131537(A) 申请公布日期 1988.06.03
申请号 JP19860276597 申请日期 1986.11.21
申请人 HITACHI LTD 发明人 SAWAHATA YASUO;SAITO RYUICHI;KAWAKAMI SUMIO
分类号 H01L21/76 主分类号 H01L21/76
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