ELECTRONIC PACKAGE

摘要

An electronic packaging structure (10) includes a second level electronic package (12) having at least one opening (14) formed therein and circuitry (20) for electrical connection to a semiconductor chip. A circuitized polyimide film chip carrier (26) includes at least one semiconductor chip (24) mounted on one major surface thereof and at least one decoupling capacitor (34) mounted on an opposite surface thereof. The decoupling capacitor is electrically coupled to input/output contacts of the semiconductor chip. The carrier is then mounted on the second level electronic package so that one semiconductor chip is positioned within a respective opening and the circuitry formed on the carrier is coupled to the circuitry formed on the second level package thereby interconnecting the semiconductor chip to the electronic package.