发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:To obtain the title composition which is excellent in leveling property and can give a cured product excellent in strength, by mixing an epoxy resin with a curing agent, spherical silica and microparticulate silica. CONSTITUTION:A filler (c) is obtained by mixing spherical silica (i) of a particle diameter of 10-30mum with microparticulate silica of a particle diameter smaller than that of component (i) at a component (i) to component (ii) mixing ratio of 1-5/1. An epoxy resin (a) (e.g., bisphenol A epoxy resin) is mixed with 10-30PHR, based on component (a), epoxy curing agent (b) (e.g., 2,4- dihydrazino-6-methylamino-sym-triazine), 30-80% (filler ratio) component (c) and, optionally, a cure accelerator (e.g., 2-ethylmethylimidazole), a coupling agent, a thixotropic agent, a leveling agent, a diluent, a flame retardant, a lubricant, etc., (d).
申请公布号 JPS63130626(A) 申请公布日期 1988.06.02
申请号 JP19860278241 申请日期 1986.11.20
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 HINO HIROHISA
分类号 C08K3/36;C08G59/00;C08G59/18;C08K7/26;C08L63/00 主分类号 C08K3/36
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