发明名称 SOLDER COATING METHOD ON LEAD FRAME
摘要 <p>PURPOSE:To form a solder film which is uniform and thin, and has high quality and good wettability, by applying a flux to a necessary part of a string line lead frame, allowing solder fine powder to adhere to said flux, melting it in inert gas, and forming a solder layer. CONSTITUTION:A flux 3 is applied to a solder facing necessary part 2 of a string line lead frame 1 after bonding and molding. Subsequently, solder fine powder 4 is brought to fluidization in a state of mist, and allowed to adhere onto the flux 3. Next, it is allowed to reflow in an inert gas 5, the solder fine powder 4 is melted, and a solder film 7 is formed on the necessary part 2. Thereafter, unnecessary solder and flux are washed 14 and eliminated. According to this method, coating of a solder film can be formed uniformly and with high accuracy to the necessary part of a lead frame in a state of string line.</p>
申请公布号 JPS63130264(A) 申请公布日期 1988.06.02
申请号 JP19860277496 申请日期 1986.11.19
申请人 FUJI PLANT KOGYO KK 发明人 HOJO TETSUYA;KAMIYAMA MOTOI
分类号 B23K1/20;B23K3/00;B23K3/06;H01L23/50 主分类号 B23K1/20
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