| 摘要 |
PURPOSE:To reduce the facility cost of a mold by forming an injection mold in a sole lot, sequentially feeding the molds, and sequentially molding an element on a leadframe. CONSTITUTION:A pot 11 is provided at the center of an injection mold 10, resin is filled to four adjacent cavities from the pot 11, thereby producing four semiconductor elements once. The mold 10 is disposed on part of the leadframe 13, and molds like black coating of the semiconductor element. The leadframe 13 is fed for one lot continued to the initial molding, and adjacent element is similarly molded. This is sequentially repeated, the all elements of the leadframe 13 are molded. When thus constructed, the facility cost of the molds can be reduced as compared with multiple lot type. |
