| 摘要 |
The invention relates to a method of manufacturing a hermetically sealed component housing having a tray-like upper portion and a tray-like lower portion of an insulating material, which portions are hermetically sealed to each other, the lead-in conductors to the component being accommodated in the junction between the upper and lower portion of the housing. The lead-in conductors to the component are so formed that they partially extend in a longitudinal direction between the connecting surfaces of the upper portion and the lower portion of the housing, and the housing portions with the intermediate lead-in conductors are interconnected by heating in a high-frequency field the individual lead-in conductors, which are interconnected to form an annular conductor, until the housing portions are interconnected. |
