| 摘要 |
PURPOSE:To enable the quality to be improved markedly by preventing resin part from cracking by a method wherein an organic coating hardly bonding to sealing resin is formed on the back surface of a tab loaded with a semiconductor element and a tab hanging lead holding the tab. CONSTITUTION:A silicon base organic coating 7 is formed on the back surface of a tab 2 loaded with a semiconductor element 1 and a tab hanging lead 3 while whole body is resin-sealed with epoxy base resin 6. Furthermore, nickel 45 % alloy is used as the raw material of tab 2, the tab hanging lead 3, inner lead 4a and outer lead 4b.
|
