发明名称 METHOD OF APPLYING RESIST
摘要 PURPOSE:To eliminate striation and obtain a thin film with a uniform thickness by a method wherein the spinning speed of a substrate is repeatedly varied from zero or a low speed to a high peak speed and from the high speed to zero or the low speed. CONSTITUTION:During a stational period A, resist is dropped normally and, during a low speed spinning period B, the resist is spread over the whole surface of a substrate to stabilize the adhesiveness between the resist and the substrate. During a spinning-off period C, the excessive resist is spun off from the substrate and only the resist required to form the film with a required thickness is left. During a final drying period D, the spinning speed of the substrate is varied repeatedly and intermittently from zero to a peak value of 3000 rpm and from the peak value to zero and then from zero to a peak value of 2500 rpm and from the peak value to zero again and so forth. With this speed variation, forces F1 and F2 are applied to the cross section of the striation in the resist 2 on the substrate 1 at the time of speed change and material flow from a protruding part 3 to a recessed part 4 is created and the flow is balanced when the thickness becomes uniform.
申请公布号 JPS63128628(A) 申请公布日期 1988.06.01
申请号 JP19860275910 申请日期 1986.11.18
申请人 NEC CORP 发明人 TANIGAWA TETSUJI
分类号 B05D1/40;G03F7/16;H01L21/027;H01L21/30 主分类号 B05D1/40
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